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| EMIF04-EAR01F2 4-line IPADTM, EMI filter and ESD protection Features EMI (I/O) low-pass filter High efficiency in EMI filtering High density capacitor Very low PCB space occupation: 1.92 x 1.42 mm Very thin package: 0.65 mm High efficiency in ESD suppression on external pins (IEC 61000-4-2 level 4) High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Figure 1. Flip Chip (11 bumps) Pin configuration (bump side) 1 I1 I2 I3 I4 2 GND 3 O1 O2 A B C D Complies with the following standards IEC 61000-4-2 Level 4, on output pins - 15 kV (air discharge) IEC 61000-4-2 Level 1, on input pins - 2 kV (air discharge) GND GND O3 O4 Applications Where EMI filtering in ESD sensitive equipment is required: Figure 2. I1 I2 I3 I4 Schematic R C R C R C R C O1 O2 O3 04 Earpiece and headset for mobile phones PDAs MP3 players Description The EMIF04-EAR01F2 is a 4-line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF04 Flip Chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up 15 kV. GND = A2, C2, D2 TM: IPAD is a trademark of STMicroelectronics. April 2008 Rev 2 1/7 www.st.com 7 Characteristics EMIF04-EAR01F2 1 Characteristics Table 1. Symbol Absolute maximum ratings (Tamb = 25 C) Parameter and test conditions Output pins (A3, B3, C3, D3) ESD discharge IEC61000-4-2, air discharge Value Unit 15 kV VPP Input pins (A1, B1, C1, D1) ESD discharge IEC61000-4-2, air discharge Tj Top Tstg Maximum junction temperature Operating temperature range Storage temperature range 2 125 - 40 to + 85 - 55 to + 150 C C C Table 2. Symbol VBR IRM VRM VCL Rd IPP R C Symbol VBR IRM R C Electrical characteristics (Tamb = 25 C) Parameter I Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between input and output Capacitance Test conditions IR = 1 mA VRM = 3 V per line Tolerance 30% VLINE = 0 V, VOSC = 30 mV, F = 1 MHz Tolerance 20% VCL VBR VRM IPP IR IRM IRM IR VRM VBR VCL V IPP Min. 14 Typ. Max. 18 500 Unit V nA nF 10 5.8 2/7 EMIF04-EAR01F2 Characteristics Figure 3. 0.00 S21 (db) all lines attenuation dB Figure 4. dB 0.00 -10.00 Analog cross talk -10.00 -20.00 -30.00 -20.00 -40.00 -50.00 -30.00 -60.00 -70.00 -40.00 -80.00 F (Hz) -50.00 10.0M 30.0M Line 1 Line 3 100.0M 300.0M 1.0G Line 2 Line 4 3.0G -90.00 -100.00 100.0k 1.0M Xtalk 10.0M F (Hz) 100.0M 1.0G Figure 5. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one output 5 V/div Figure 6. ESD response to IEC 61000-4-2 (-15 kV air discharge) on one output 5 V/div 80 ns/div 80 ns/div Figure 7. Line capacitance versus reverse applied voltage Cline (nF) 9 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 F = 1 Mhz V osc = 30 mVRMS Tj = 25 C V line (V) 6 7 8 9 3/7 Ordering information scheme EMIF04-EAR01F2 2 Ordering information scheme Figure 8. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 2: Lead-free, pitch = 500 m, bump = 310 m yy - xxx zz Fx 3 Packaging information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 9. Flip Chip package dimensions 500 m 50 310 m 50 650 m 65 500 m 50 210 m 1.92mm 50 m 4/7 210 m 1.42mm 50 m EMIF04-EAR01F2 Packaging information Figure 10. Footprint recommendations Figure 11. Marking Copper pad Diameter 250 m recommended, 300 m max Solder stencil opening: 330 m Dot, ST logo xx = marking z = manufacturing location yww = datecode (Y = year ww = week) E Solder mask opening recommendation: 340 m min for 300 m copper pad diameter xxz y ww Figure 12. Flip Chip tape and reel specifications Dot identifying Pin A1 location 4 0.1 O 1.5 0.1 1.75 0.1 3.5 0.1 1.56 0.73 0.05 All dimensions in mm 8 0.3 2.02 STE STE STE xxx yww User direction of unreeling xxx yww xxx yww 4 0.1 Note: Note: More information is available in the application note: AN2348:"Flip Chip: Package description and recommendations for use" AN1751: "EMI filters: Recommendations and measurements" 5/7 Ordering information EMIF04-EAR01F2 4 Ordering information Table 3. Ordering information Marking GK Package Flip Chip Weight 3.8 mg Base qty 5000 Delivery mode Tape and reel 7" Order code EMIF04-EAR01F2 5 Revision history Table 4. Date 06-Oct-2006 28-Apr-2008 Document revision history Revision 1 2 Initial release. Updated ECOPACK statement. Updated figures Figure 9, and Figure 12. Reformatted to current standards. Changes 6/7 EMIF04-EAR01F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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